The latest bonding machine developed by Cedatec, Multilayer Inductive Bonding System BONDING 168, has been designed with the most advanced 8G induction bonding system which provides a bonding strength and capacity of more than 50% along with a low-power consumption.
This new-generation machine does not have any limitation on the layer number it can handle.
The Bonding 168 machine makes the coupling of the various layers to be processed in any Hot Press.
It uses a template where the layers are held in a precise position by pins.
The layers will be stuck together by 4 pairs of welder heads acting like pliers to grip the layers and fuse the resin in small peripheral areas of prepreg while they are pressing.