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Epoxy Adhesive FCCL

Epoxy Adhesive FCCL

Epoxy Adhesive PI

Cipel delivers a wide range of Epoxy Adhesive polyimide FCCL used in several digital and electronic devices. Compared to a rigid circuit board made of FR4, which makes up a standard printed circuit board (PCB), FPCB is primarily used in many applications requiring light weight, small size, high density, high flexibility and repeatability.

FCCL (Flexible Copper Clad laminate) 

FCCL

FCCL  copper-clad laminated composites are constructed of polyimide film with copper foil on one or both sides, bonded together with a proprietary C-staged modified epoxy adhesive. All copper-clad laminates are available with rolled, annealed copper or electro-deposited copper.

Double sided FCCL Construction

  • Excellent Flexibility & Electrical properties
  • Good dimensional stability
  • Excellent Chemical resistance
  • Storage at room temperature of 12 months
  • All products meet RoHS requirements
  • PI thickness from 12,5 µ up to 100 µ
  • Copper thickness from 9 µ up to 105 µ
  • Available in single side copper construction

Coverlay or Stiffener

Coverlay or Stiffener

Coverlay or Stiffener is a composite of polyimide film, coated on one side with a B-stage epoxy adhesive. Coverlay can be used to encapsulate etched details in flexible and multilayer constructions for environmental protection and electrical insulation

  • Wide range of PI thickness (25-225 µ)
  • Epoxy or Acrilyc Adhesive
  • Available in White color for lighting applications

Bonding Sheet

Bonding Sheet

Bonding Sheet is a proprietary, flame retardant, B-staged modified epoxy adhesive. Sheet adhesive is used primarily to bond flexible circuits to rigid board during the fabrication of rigid - flex circuits, as well as to bond stiffeners and heat sinks.

  • Epoxy Adhesive
  • Adhesive Thickness from 12,5 µ up to 75 µ
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